Canteliver Probe Card
MPI Cantilever Probe Card is commonly used on gold bump and pad wafer tests for display driver, logic, and memory system. MPI’s cantilever probes are the corresponding response towards the needs of fine pitch, compact pad size, large velocity, fewer cleaning, multi-DUT, significant pin count, and ultra-low leakage demands. With superb craftsmanship, impressive architecture and tested methodologies based on mechanical and electrical simulation/measurement effects, earning MPI the highest cantilever supplier throughout the world.
FCB Probe Card
The FCB Probe Card is the most mature technological innovation of buckling beam probe card. It's aimed to accomplish the semiconductor ship manufacture time-to-marketplace (TTM) and cost of examination (COT) need. FCB is a proven solution for several different semiconductor output assessments from early engineering pilot-runs to substantial quantity manufacturing (HVM). FCB is ready for machine requiring high signal integrity probing (SI) and/or electric power integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB ensures the planet’s best Over-all Expense-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card can be an enhancement over the traditional buckling beam probe card. Important options are here larger current carrying ability (C.C.C.) and reduce well balanced Get in touch with pressure (BCF), in addition to In general MEMS-like qualities. EVS can certainly meet the prerequisite of advanced wafer probing. Exact alignment and fantastic planarity Handle are the essential factors contributing to stable Get hold of resistance. With its capacity and functionality, EVS Probe Card is a super choice for Innovative probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s solution to need for at any time finer pitch. It is actually designed for smaller sized Al pad, which is perfect for very small pitch application with peripheral and complete array pattern. With exact alignment and superior planarity Command, Osprey can reach larger productiveness by multi-DUT style and design. The forming wire (FW) kind needle generated with MPI’s have micro fabrication process not just provides superior-quality overall performance but additionally permits effortless needle alternative and shortens keeping cycle time.
Kestrel Probe Card
The Kestrel Probe Card is supplied with MEMS wire (MW) needle that's created for the need of minimal force probing. Additionally, it comes with the ability to fulfill significant C.C.C. and substantial pin counts application. The MEMS method ensures highly consistent needle properties, as well as Exclusive construction style enables exact alignment and planarity Handle.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/